6 LAYER PCB · ENGINEERING RESOURCE
6 layer pcb surface finishes: compare the assembly requirements
Request a project reviewA surface finish protects exposed copper and influences assembly and contact behavior. Select it around component geometry, soldering process, storage and the intended end use.
ENIG
Electroless nickel immersion gold provides a relatively planar solderable surface. Specify the applicable requirements and consider how the finish interacts with the application. A finish name alone is not a complete acceptance specification.
Lead-free HASL
Hot-air solder leveling is a widely used option. Surface topography and the thermal process need to be considered for the intended pad sizes and assembly route. Compare the actual geometry rather than assuming every finish is interchangeable.
OSP and other options
Organic solderability preservatives protect copper with an organic layer. Handling, storage and assembly cycles matter. Other finishes may be appropriate for specific requirements, subject to process availability and engineering review.
Specify your finish, storage and assembly conditions in the quotation request.
What to document
- Required finish and any selective finish regions
- Relevant acceptance requirements
- Assembly process and expected handling
- Storage conditions and intended shelf life